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Dimer Acid And Diamine Polycondensate Polyamide Resin For Hot Melting Adhesive

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Dimer Acid And Diamine Polycondensate Polyamide Resin For Hot Melting Adhesive

Dimer Acid And Diamine Polycondensate Polyamide Resin For Hot Melting Adhesive
Dimer Acid And Diamine Polycondensate Polyamide Resin For Hot Melting Adhesive Dimer Acid And Diamine Polycondensate Polyamide Resin For Hot Melting Adhesive Dimer Acid And Diamine Polycondensate Polyamide Resin For Hot Melting Adhesive Dimer Acid And Diamine Polycondensate Polyamide Resin For Hot Melting Adhesive Dimer Acid And Diamine Polycondensate Polyamide Resin For Hot Melting Adhesive Dimer Acid And Diamine Polycondensate Polyamide Resin For Hot Melting Adhesive

Large Image :  Dimer Acid And Diamine Polycondensate Polyamide Resin For Hot Melting Adhesive

Product Details:
Place of Origin: China
Brand Name: Briture
Certification: ISO
Model Number: Polyamide Resin
Payment & Shipping Terms:
Minimum Order Quantity: 1000KGS
Price: USD 4.00/KGS
Packaging Details: 25kgs net per bag
Delivery Time: 9-12work days
Payment Terms: L/C, T/T
Supply Ability: 30000MT/year

Dimer Acid And Diamine Polycondensate Polyamide Resin For Hot Melting Adhesive

Description
Acid Value ( MgKOH/ G): 5 Max Amine Value (mgKOH/ G): 5 Max
Solvent Viscosity* (mPa · S/25℃): 150-450 Melt Viscosity (mPa ·s/ 160℃): 1500-8000
Softening Point (℃): 105-130 Color (Fe-Co): 8 Max
High Light:

Polycondensate Polyamide Hot Melt Adhesive Resin

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Polyamide Hot Melt Adhesive Resin

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Diamine Polyamide Resin

The Polycondensate Of Dimer Acid And Diamine Polyamide Resin For Melting Adhesive

 

Product Description:

Polyamide Hot Melt Adhesive is the polycondensate of dimer acid and diamine. It is solid at room temperature, but liquid uner melting state with good liguidity and adhesive ability, and will form high strength adhesion after solidifying and cooling. Polyamide hot melt adhesive has excellent thermostability and flexibility, as well as good solubility & melting properties at low temperature.
 
1 . Chemistry name: polyamide hot melt adhesive.
2 . Appearance: light yellow granular transparent solid.
3 . Properties: non- toxic, no irritant, dissolve in most organic solvents, insoluble in water. polyamide hot melt adhesive has a good solubility at low temperature, high temperature melting, excellent thermal stability and strong flexibility stretchability.
4 . Application: mainly used for attire, shoes, leather, electronic devices, melting adhesive. Also used for wood, plastic, metal,ceramics etc.
5 . Packing: kraft bag lined with plastic bag, 25 kg/bag net.
6 . Storage: to be stored in cool, ventilated and dry place.

 

Specification:

 
Item Index
 
BT-208A
BT-208B
BT-208C
BT-288
BT-208E
Acid value ( mgKOH/ g)
5max 5max 5max 5max 5max
Amine value (mgKOH/ g)
5max 5max 5max 5max 5max
Solvent viscosity* (mPa · s/25℃)
150- 190
200-300
200-300
200-400
250-450
Melt viscosity (mPa ·s/ 160℃)
1500-3000
2000-4500
2000-5000
2000-4500
3000-8000
Softening point (℃)
105- 115
105- 115
100- 110
95- 105
110- 130
Color (Fe-Co)
8max 8max 8max 8max 8max

 

*4 0% Polyamide Hot Melt Adhesive, 60% Mixed reagent ( Quantity Ratio-- xylene: absolute ethyl alcohol: isopropyl alcohol = 1:1:1 )

Contact Details
Briture Co., Ltd.

Contact Person: Linda Qiang

Tel: 0086-13856999452

Fax: 86-551-63517768

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