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The Polycondensate Of Dimer Acid And Diamine Polyamide Resin For Melting Adhesive

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The Polycondensate Of Dimer Acid And Diamine Polyamide Resin For Melting Adhesive

The Polycondensate Of Dimer Acid And Diamine Polyamide Resin For Melting Adhesive
The Polycondensate Of Dimer Acid And Diamine Polyamide Resin For Melting Adhesive The Polycondensate Of Dimer Acid And Diamine Polyamide Resin For Melting Adhesive The Polycondensate Of Dimer Acid And Diamine Polyamide Resin For Melting Adhesive The Polycondensate Of Dimer Acid And Diamine Polyamide Resin For Melting Adhesive The Polycondensate Of Dimer Acid And Diamine Polyamide Resin For Melting Adhesive The Polycondensate Of Dimer Acid And Diamine Polyamide Resin For Melting Adhesive

Large Image :  The Polycondensate Of Dimer Acid And Diamine Polyamide Resin For Melting Adhesive

Product Details:
Place of Origin: Anhui,China
Brand Name: Briture
Certification: ISO
Model Number: Polyamide Resin BT-208A
Payment & Shipping Terms:
Minimum Order Quantity: 1000KGS
Price: USD 4.05-4.17/KGS
Packaging Details: 25kgs net each bag
Delivery Time: 9-15work days
Payment Terms: L/C, T/T
Supply Ability: 8000MT/year

The Polycondensate Of Dimer Acid And Diamine Polyamide Resin For Melting Adhesive

Description
Acid Value ( MgKOH/ G): ≤ 5 Amine Value (mgKOH/ G): ≤ 5
Solvent Viscosity* (mPa · S/25℃): 150-190 Melt Viscosity (mPa ·s/ 160℃): 1500-3000
Softening Point (℃): 105-115
High Light:

Dimer Acid Polycondensate Polyamide Resin

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Melting Adhesive Polyamide Resin

The Polycondensate Of Dimer Acid And Diamine Polyamide Resin For Melting Adhesive

 

Instruction:

Polyamide resin is also a polyamide hot melt adhesive, which is a condensation of dimeric acid and diamine. This product is solid at room temperature and liquid in the molten state, it has good fluidity and bonding ability, and will form high strength adhesion after solidification and cooling. In addition, it is also a polyamide resin is also a polyamide hot melt adhesive, which is a polycondensation of dimeric acid and diamine. This product is solid at room temperature and liquid in the molten state, it has good fluidity and bonding ability, and will form high strength adhesion after solidification and cooling. In addition, it also has excellent thermal stability and flexibility, and has good solubility and melting property at low temperatures. It has excellent thermal stability and flexibility, and has good solubility and melting property at low temperatures.

 

Polyamide Resin is light yellow granular transparent solid product, which is non- toxic, no irritant, dissolve in most organic solvents, insoluble in water. polyamide hot melt adhesive has a good solubility at low temperature.

 

Application: It mainly used for attire, shoes, leather, electronic devices, melting adhesive. Also used for wood, plastic, metal, ceramics etc

 

Specification:

 

Item
BT-208A
Acid value ( mgKOH/ g) ≤ 5
Amine value (mgKOH/ g) ≤ 5
Solvent viscosity* (mPa · s/25℃) 150- 190
Melt viscosity (mPa ·s/ 160℃) 1500-3000
Softening point (℃) 105- 115
Color (Fe-Co) ≤ 8

 

Packing: 25kgs net each bag

 

Storage: to be stored in cool, ventilated and dry place

 

Certification:

The Polycondensate Of Dimer Acid And Diamine Polyamide Resin For Melting Adhesive 0

Contact Details
Briture Co., Ltd.

Contact Person: Linda Qiang

Tel: 0086-13856999452

Fax: 86-551-63517768

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